Three Dimensional Nanotextured Pyramidal Copper Mesh for Pool-Boiling Enhancement
Increasing heat removal rate is essential prerequisite for the development of next-generation microelectronic
devices. Pool boiling is a process by which heat is removed by upon vaporization of a coolant fluid upon an immersed
heated surface often finding application to cooling high-performance computing systems. Increasing the surface-to-volume
ratio in confined spaces is required to improve this cooling method. Herein we introduce textured copper pillars with varied
geometric arrangements and study their effects on pool boiling performance. Frustum-pyramid pillars were formed by
supersonic spraying of copper micro-particles through a wire mesh to form pillars of various sizes. We identified the optimal
pool boiling scenario corresponding to the maximum cross-flow coolant velocity over the pyramids. Maximum bubble
nucleation was achieved for a specific geometric arrangement. Such a geometric design can be installed in heat-pipe cooling
systems to cool electronic devices.
Index Terms- Supersonic Spraying, Copper Nanoparticles, Pool Boiling, Superheat Temperature, Critical Heat Flux.