Investigation on Laterally Perforated Plate-Fin Heat Sink
Over the past several decades, the development of electronic devices has led to higher performance. Therefore, an
electronic cooling system is important for the electronic device. A heat sink which is a part of the electronic cooling system, is
continuously studied in research field to enhance the heat transfer. Many researchers have studied heat transfer enhancement of
plate-fin heat sink by modification on fin geometry. However, there have been only a few articles which reported the thermal
performance of plate-fin heat sink with perforation. This research aims to study on the flow and heat transfer characteristics of
solid-fin heat sink (SFHS) and laterally perforated plate-fin heat sink (LAP-PFHS). The SFHS and LAP-PFHSs are
investigated on the same fin dimensions. The LAP-PFHSs are performed with a 27 perforation number and two different
diameters of circular perforation (3 mm and 5 mm). The experimental study is conducted under various Reynolds numbers
from 900 to 2,700 and the heat input of 50W. The experimental results show that the LAP-PFHS with perforation diameter of
5 mm gives the minimum thermal resistance about 25% lower than SFHS. The thermal performance factor which take into
account of the ratio of the Nusselt number and ratio of friction factor is used to find the suitable design parameters. The
experimental results show that the LAP-PFHS with the perforation diameter of 3 mm provides the thermal performance of
15% greater than SFHS. In addition, the simulation study is presented to investigate the effect of the air flow behavior inside
the perforation on the thermal performance of LAP-PFHS.
Keywords - Heat Sink, Parallel Flow, Circular Perforation, Non-Bypass Flow.