Paper Title
The Influence of Material Properties and Geometry on the Thermal Behaviour of Adhesively Bonded Ceramic-Metal Structure

The approximate analytical method Shear lag is used to show the influence of the type of glue on the behaviour of the interfacial stresses and debonding lengths in two plate’s ceramic-metal structure. The plates (with/without normal crack) are bonded together by an interfacial zero thickness adhesive layer and subjected to thermal loading. The occurrence of thermal peeling stress is due to the elastic and thermal mismatch of the structure, and it is determined via the interfacial shear stress. Under critical shear stress the interface is assumed to exhibit brittle failure. For selected bi-material structures composed of a recycled material (recycled titanium scrap) the values of the peeling stress and the interfacial delamination are calculated and compared accounting for two different types of adhesive layers (glues). Index Terms- Delamination of adhesively bonded structures, Recycled Materials, Thermal loading, Interfacial thermal stresses.